Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376904 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Donald V. Perino | 2002-04-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376904 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Donald V. Perino | 2002-04-23 |