Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6496889 | Chip-to-chip communication system using an ac-coupled bus and devices employed in same | Haw-Jyh Liaw, Alfredo Moncayo, Kevin S. Donnelly, Richard M. Barth, Bruno W. Garlepp | 2002-12-17 |
| 6447321 | Socket for coupling an integrated circuit package to a printed circuit board | John B. Dillon | 2002-09-10 |
| 6426984 | Apparatus and method for reducing clock signal phase skew in a master-slave system with multiple latent clock cycles | Haw-Jyh Liaw, Kevin S. Donnelly | 2002-07-30 |
| 6404660 | Semiconductor package with a controlled impedance bus and method of forming same | Nader Gamini | 2002-06-11 |
| 6376904 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Sayeh Khalili | 2002-04-23 |
| 6359931 | Apparatus and method for multilevel signaling | John B. Dillon | 2002-03-19 |
| 6352435 | Chip socket assembly and chip file assembly for semiconductor chips | Wayne S. Richardson, John B. Dillon | 2002-03-05 |