Issued Patents 2002
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488575 | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines | Vishnu K. Agarwal | 2002-12-03 |
| 6485356 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2002-11-26 |
| 6472323 | Method of depositing tungsten nitride using a source gas comprising silicon | Trung T. Doan | 2002-10-29 |
| 6451658 | Graded layer for use in semiconductor circuits and method for making same | Salman Akram | 2002-09-17 |
| 6450863 | Method and apparatus for uniformly planarizing a microelectronic substrate | Stephen J. Kramer | 2002-09-17 |
| 6440319 | Method and apparatus for predicting process characteristics of polyurethane pads | Guy F. Hudson | 2002-08-27 |
| 6432818 | Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices | Salman Akram | 2002-08-13 |
| 6429086 | Method of depositing tungsten nitride using a source gas comprising silicon | Trung T. Doan | 2002-08-06 |
| 6426295 | Reduction of surface roughness during chemical mechanical planarization(CMP) | Stephen J. Kramer | 2002-07-30 |
| 6426288 | Method for removing an upper layer of material from a semiconductor wafer | — | 2002-07-30 |
| 6416401 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2002-07-09 |
| 6404057 | Tantalum - aluminum - nitrogen material for semiconductor devices | Salman Akram | 2002-06-11 |
| 6402884 | Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies | Karl M. Robinson | 2002-06-11 |
| 6395620 | Method for forming a planar surface over low density field areas on a semiconductor wafer | Pai-Hung Pan | 2002-05-28 |
| 6379225 | Planarization process with abrasive polishing slurry that is selective to a planarized surface | Karl M. Robinson, Guy F. Hudson | 2002-04-30 |
| 6361832 | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines | Vishnu K. Agarwal | 2002-03-26 |
| 6358122 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2002-03-19 |