Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6447634 | Method and apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh Stroupe, Todd A. Dobson, Brian F. Gordon | 2002-09-10 |
| 6440319 | Method and apparatus for predicting process characteristics of polyurethane pads | Scott Meikle | 2002-08-27 |
| 6407000 | Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies | — | 2002-06-18 |
| 6379225 | Planarization process with abrasive polishing slurry that is selective to a planarized surface | Karl M. Robinson, Scott Meikle | 2002-04-30 |
| 6368194 | Apparatus for controlling PH during planarization and cleaning of microelectronic substrates | Judson R. Sharples, Kenneth F. Zacharias | 2002-04-09 |