Issued Patents 2002
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492273 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies | Jim Hofmann, Stephen J. Kramer, Scott E. Moore | 2002-12-10 |
| 6485356 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Scott Meikle | 2002-11-26 |
| 6472325 | Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies | Jim Hofmann, Stephen J. Kramer, Scott E. Moore | 2002-10-29 |
| 6468912 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies | Jim Hofmann, Stephen J. Kramer, Scott E. Moore | 2002-10-22 |
| 6464824 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies | James J. Hofmann, Stephen J. Kramer, Michael J. Joslyn | 2002-10-15 |
| 6461964 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies | Jim Hofmann, Stephen J. Kramer, Scott E. Moore | 2002-10-08 |
| 6419554 | Fixed abrasive chemical-mechanical planarization of titanium nitride | Dinesh Chopra | 2002-07-16 |
| 6416401 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Scott Meikle | 2002-07-09 |
| 6383934 | Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids | James J. Hofmann, Michael J. Joslyn, Whonchee Lee | 2002-05-07 |
| 6376381 | Planarizing solutions, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies | — | 2002-04-23 |
| 6358122 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Scott Meikle | 2002-03-19 |