Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489235 | Method of forming a metal seed layer for subsequent plating | Terry L. Gilton | 2002-12-03 |
| 6429133 | Composition compatible with aluminum planarization and methods therefore | — | 2002-08-06 |
| 6419554 | Fixed abrasive chemical-mechanical planarization of titanium nitride | Gundu M. Sabde | 2002-07-16 |
| 6413858 | Barrier and electroplating seed layer | — | 2002-07-02 |
| 6361411 | Method for conditioning polishing surface | Scott E. Moore | 2002-03-26 |
| 6354919 | Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies | — | 2002-03-12 |