SA

Salman Akram

Micron: 88 patents #1 of 829Top 1%
MT Micorn Technology: 1 patents #1 of 1Top 100%
📍 Boise, ID: #1 of 534 inventorsTop 1%
🗺 Idaho: #1 of 989 inventorsTop 1%
Overall (2002): #4 of 266,432Top 1%
90
Patents 2002

Issued Patents 2002

Showing 76–90 of 90 patents

Patent #TitleCo-InventorsDate
6359456 Probe card and test system for semiconductor wafers David R. Hembree, Warren M. Farnworth, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy 2002-03-19
6358833 Method of fabricating a micromachined chip scale package David R. Hembree, Warren M. Farnworth 2002-03-19
6356098 Probe card, test method and test system for semiconductor wafers C. Patrick Doherty, Warren M. Farnworth, David R. Hembree 2002-03-12
6356092 Method and apparatus for capacitively testing a semiconductor die Warren M. Farnworth 2002-03-12
6353326 Test carrier with molded interconnect for testing semiconductor components David R. Hembree, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more 2002-03-05
6353328 Test system with mechanical alignment for semiconductor chip scale packages and dice Warren M. Farnworth, David R. Hembree 2002-03-05
6351028 Multiple die stack apparatus employing T-shaped interposer elements 2002-02-26
6349396 Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit 2002-02-19
6342724 Thin film capacitor coupons for memory modules and multi-chip modules James M. Wark 2002-01-29
6339210 Circuit and method for heating an adhesive to package or rework a semiconductor die David R. Hembree 2002-01-15
6339256 Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications 2002-01-15
6338880 Chemical vapor deposition process for depositing titanium nitride films from an organometallic compound 2002-01-15
6337575 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates 2002-01-08
6337577 Interconnect and system for testing bumped semiconductor components with on-board multiplex circuitry for expanding tester resources C. Patrick Doherty, Jorge L. deVarona 2002-01-08
6335230 Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure 2002-01-01