Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6454819 | Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device | Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Masayuki Motonari, Masayuki Hattori +1 more | 2002-09-24 |
| 6444139 | Slurry for CMP and CMP method | Gaku Minamihaba | 2002-09-03 |
| 6429134 | Method of manufacturing semiconductor device | Takeo Kubota, Kenro Nakamura | 2002-08-06 |
| 6414499 | Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices | Katsuya Okumura | 2002-07-02 |
| 6409780 | Water-laden solid matter of vapor-phase processed inorganic oxide particles and slurry for polishing and manufacturing method of semiconductor devices | Nobuo Hayasaka, Katsuya Okumura, Akira Iio, Masayuki Hattori, Kiyonobu Kubota | 2002-06-25 |
| 6375545 | Chemical mechanical method of polishing wafer surfaces | Gaku Minamihaba, Yukiteru Matsui, Nobuo Hayasaka, Katsuya Okumura, Akira Iio +2 more | 2002-04-23 |
| 6337280 | Polishing cloth and method of manufacturing semiconductor device using the same | — | 2002-01-08 |