Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6454819 | Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device | Hiroyuki Yano, Yukiteru Matsui, Katsuya Okumura, Masayuki Motonari, Masayuki Hattori +1 more | 2002-09-24 |
| 6444139 | Slurry for CMP and CMP method | Hiroyuki Yano | 2002-09-03 |
| 6375545 | Chemical mechanical method of polishing wafer surfaces | Hiroyuki Yano, Yukiteru Matsui, Nobuo Hayasaka, Katsuya Okumura, Akira Iio +2 more | 2002-04-23 |