Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6459150 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Enboa Wu, Tsung-Yao Chu, Rong-Shen Lee | 2002-10-01 |
| 6433427 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Enboa Wu, Tsung-Yao Chu, Chung-Tao Chang | 2002-08-13 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Szu-Wei Lu, Kuo-Chuan Chen, Jyh-Rong Lin, Ruoh-Huey Wang, Hsu-Tien Hu | 2002-03-19 |