Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Ling-Chen Kung, Ruoh-Huey Uang, Hsu-Tien Hu | 2002-08-27 |
| 6365498 | Integrated process for I/O redistribution and passive components fabrication and devices formed | Tsung-Yao Chu, Ying-Nan Wen | 2002-04-02 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Kuo-Chuan Chen, Jyh-Rong Lin, Ruoh-Huey Wang, Hsu-Tien Hu, Hsin-Chien Huang | 2002-03-19 |