Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chia-Chung Wang, Chung-Tao Chang | 2002-09-03 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Szu-Wei Lu, Jyh-Rong Lin, Ruoh-Huey Wang, Hsu-Tien Hu, Hsin-Chien Huang | 2002-03-19 |