Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485198 | Optoelectronic transceiver having integrated optical and electronic components | Bi-Chu Wu, Chien-Chou Chen, Chih-Hsiang Ko | 2002-11-26 |
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chia-Chung Wang, Kuo-Chuan Chen | 2002-09-03 |
| 6433427 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Enboa Wu, Tsung-Yao Chu, Hsin-Chien Huang | 2002-08-13 |