Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6459150 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Tsung-Yao Chu, Hsin-Chien Huang, Rong-Shen Lee | 2002-10-01 |
| 6433427 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Tsung-Yao Chu, Hsin-Chien Huang, Chung-Tao Chang | 2002-08-13 |