Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479321 | One-step semiconductor stack packaging method | Hsing-Seng Wang | 2002-11-12 |
| 6459150 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Enboa Wu, Tsung-Yao Chu, Hsin-Chien Huang | 2002-10-01 |