Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chung-Tao Chang, Kuo-Chuan Chen | 2002-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chung-Tao Chang, Kuo-Chuan Chen | 2002-09-03 |