Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Szu-Wei Lu, Ling-Chen Kung, Ruoh-Huey Uang | 2002-08-27 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Szu-Wei Lu, Kuo-Chuan Chen, Jyh-Rong Lin, Ruoh-Huey Wang, Hsin-Chien Huang | 2002-03-19 |