Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Szu-Wei Lu, Ruoh-Huey Uang, Hsu-Tien Hu | 2002-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Szu-Wei Lu, Ruoh-Huey Uang, Hsu-Tien Hu | 2002-08-27 |