Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5660921 | Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Robert J. Twieg, Alfred Viehbeck +1 more | 1997-08-26 |
| 5599582 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more | 1997-02-04 |
| 5593720 | Process for making a multileveled electronic package | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Robert J. Twieg, Alfred Viehbeck +1 more | 1997-01-14 |