Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5700844 | Process for making a foamed polymer | Jeffrey Hedrick, Yun-Hsin Liao, Robert D. Miller, Da-Yuan Shih | 1997-12-23 |
| 5660921 | Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures | Kie Y. Ahn, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg, Alfred Viehbeck +1 more | 1997-08-26 |
| 5633034 | Process for forming a circuit assembly | Kenneth Raymond Carter, Richard Anthony DiPietro, John P. Hummel, Robert D. Miller, Martha I. Sanchez +2 more | 1997-05-27 |
| 5593720 | Process for making a multileveled electronic package | Kie Y. Ahn, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg, Alfred Viehbeck +1 more | 1997-01-14 |
| 5591285 | Fluorinated carbon polymer composites | Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more | 1997-01-07 |