Issued Patents 1997
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5700398 | Composition containing a polymer and conductive filler and use thereof | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1997-12-23 |
| 5660921 | Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg +1 more | 1997-08-26 |
| 5599582 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more | 1997-02-04 |
| 5599611 | Prepreg and cured laminate fabricated from a toughened polycyanurate | Ali Afzali-Ardakani, Jeffrey T. Gotro, Jeffrey Hedrick, Konstantinos I. Papathomas, Niranjan M. Patel +1 more | 1997-02-04 |
| 5593720 | Process for making a multileveled electronic package | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg +1 more | 1997-01-14 |
| 5591285 | Fluorinated carbon polymer composites | Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more | 1997-01-07 |