JK

Jungihl Kim

IBM: 1 patents #1,061 of 3,557Top 30%
📍 Peekskill, NY: #9 of 33 inventorsTop 30%
🗺 New York: #1,999 of 7,187 inventorsTop 30%
Overall (1997): #124,606 of 185,788Top 70%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more 1997-02-04