TO

Tae S. Oh

IBM: 1 patents #1,061 of 3,557Top 30%
📍 Cheongnyang-eup, KR: #1 of 1 inventorsTop 100%
Overall (1997): #71,264 of 185,788Top 40%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman +4 more 1997-02-04