Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5700398 | Composition containing a polymer and conductive filler and use thereof | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more | 1997-12-23 |
| 5633047 | Electronic devices having metallurgies containing copper-semiconductor compounds | Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more | 1997-05-27 |
| 5599582 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more | 1997-02-04 |