Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11719685 | Selection method of base asphalt for rubber asphalt based on grey relational analysis | Honggang Zhang, Jizong Tan, Haitao Yuan, Hongbo Zhang, Baolin Xiong +3 more | 2023-08-08 |
| 11710681 | Semiconductor packages and methods of packaging semiconductor devices | Tanawan Chaowasakoo, Alexander Lucero Laylo, Thanawat Jaengkrajarng | 2023-07-25 |
| 11687291 | Techniques for non-consecutive logical addresses | Fangwen Zhou, Wenjing Chen | 2023-06-27 |
| 11676934 | Clip bond semiconductor packages and assembly tools | Albert Louis Bove, Aaron Tan | 2023-06-13 |
| 11670375 | Memory with improved cross temperature reliability and read performance | Jingxun Eric Wu, Yingying Zhu, Hui-Kap Yang, Bo Zhou | 2023-06-06 |
| 11648551 | Sample manipulation and assay with rapid temperature change | Stephen Y. Chou, Wei Ding, Ji Qi, Yufan Zhang | 2023-05-16 |
| 11379367 | Enhancement for activation and deactivation of memory address regions | Nicola Colella, Antonino Pollio | 2022-07-05 |
| 11369968 | Molecular manipulation and assay with controlled temperature (II) | Stephen Y. Chou, Wei Ding, Yufan Zhang | 2022-06-28 |
| 11177301 | Reliable semiconductor packages | Chee Kay Chow, Thian Hwee Tan, Wedanni Linsangan Micla, Enrique Jr Sarile, Mario Arwin Simon Fabian +6 more | 2021-11-16 |
| 11145575 | Conductive bonding layer with spacers between a package substrate and chip | Tanawan Chaowasakoo, Alexander Lucero Laylo, Thanawat Jaengkrajarng | 2021-10-12 |
| 11139233 | Cavity wall structure for semiconductor packaging | Wilson Poh Leng Ong, Kriangsak Sae Le, Saravuth Sirinorakul, Somsak Phukronghin, Paweena Phatto | 2021-10-05 |
| 11107533 | Memory with improved cross temperature reliability and read performance | Jingxun Eric Wu, Yingying Zhu, Hui-Kap Yang, Bo Zhou | 2021-08-31 |
| D912842 | Assay plate | Stephen Y. Chou, Wei Ding, Ji Qi | 2021-03-09 |
| 10926265 | Molecular manipulation and assay with controlled temperature (II) | Stephen Y. Chou, Wei Ding, Yufan Zhang | 2021-02-23 |
| D910203 | Assay plate with sample landing mark | Stephen Y. Chou, Wei Ding, Ji Qi | 2021-02-09 |
| D910202 | Assay plate with sample landing mark | Stephen Y. Chou, Wei Ding, Ji Qi | 2021-02-09 |
| D898939 | Assay plate with sample landing mark | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-10-13 |
| 10792944 | Drying media | Gary Tarver, Jayanta C. Panditaratne, Jason Hower, James Kearns | 2020-10-06 |
| D898224 | Assay plate with sample landing mark | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-10-06 |
| D898222 | Assay card | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-10-06 |
| D898221 | Assay plate | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-10-06 |
| D897555 | Assay card | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-09-29 |
| D893469 | Phone holder | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-08-18 |
| D893470 | Phone holder | Stephen Y. Chou, Wei Ding, Ji Qi | 2020-08-18 |
| 10707161 | Cavity wall structure for semiconductor packaging | Wilson Poh Leng Ong, Kriangsak Sae Le, Saravuth Sirinorakul, Somsak Phukronghin, Paweena Phatto | 2020-07-07 |