Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676934 | Clip bond semiconductor packages and assembly tools | Albert Louis Bove, Hua Tan | 2023-06-13 |
| 10632252 | Subcutaneous infusion device for injecting medicinal substances | Atif M. Yardimci, Tejas Dhyani, Nathan Mitchell, Eric Bernard Jedrzejek, Chinmay Kanuga | 2020-04-28 |