AB

Albert Louis Bove

UP Utac Headquarters Pte.: 1 patents #56 of 101Top 60%
📍 Singapore, SG: #6,661 of 13,971 inventorsTop 50%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11676934 Clip bond semiconductor packages and assembly tools Hua Tan, Aaron Tan 2023-06-13