Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710681 | Semiconductor packages and methods of packaging semiconductor devices | Hua Tan, Alexander Lucero Laylo, Thanawat Jaengkrajarng | 2023-07-25 |
| 11145575 | Conductive bonding layer with spacers between a package substrate and chip | Hua Tan, Alexander Lucero Laylo, Thanawat Jaengkrajarng | 2021-10-12 |