Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425134 | Chip package | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2016-08-23 |
| 9355970 | Chip package and method for forming the same | Chao-Yen Lin, Wei-Luen SUEN, Chien-Hui Chen | 2016-05-31 |
| 9355975 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-05-31 |
| 9287417 | Semiconductor chip package and method for manufacturing thereof | Wei-Luen SUEN, Shu-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu | 2016-03-15 |
| 9209124 | Chip package | Chao-Yen Lin, Wei-Luen SUEN, Chien-Hui Chen | 2015-12-08 |
| 9136241 | Chip package and manufacturing method thereof | Yu-Lin Yen, Kuo-Hua Liu, Tsang-Yu Liu, Yen-Shih Ho | 2015-09-15 |
| 9006896 | Chip package and method for forming the same | Tsang-Yu Liu, Shu-Ming Chang | 2015-04-14 |
| 8963312 | Stacked chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2015-02-24 |
| 8952501 | Chip package and method for forming the same | Chao-Yen Lin, Wei-Luen SUEN, Chien-Hui Chen | 2015-02-10 |
| 8890268 | Chip package and fabrication method thereof | Tsang-Yu Liu | 2014-11-18 |
| 8785247 | Chip package and method for forming the same | Yu-Ting Huang | 2014-07-22 |
| 8741683 | Chip package and fabrication method thereof | Tsang-Yu Liu | 2014-06-03 |
| 8692358 | Image sensor chip package and method for forming the same | Tzu-Hsiang Hung, Yen-Shih Ho | 2014-04-08 |
| 8581386 | Chip package | Yu-Lin Yen, Shih-Ming Chen, Hsi-Chien Lin, Tsang-Yu Liu | 2013-11-12 |
| 8508028 | Chip package and method for forming the same | Yu-Ting Huang | 2013-08-13 |