| 6217902 |
Soft gelatin capsules containing particulate material |
Keith Tanner, Gregory A. Schurig, Frank S. S. Morton, Brian R. Pansari, Rickey S. Shelley +1 more |
2001-04-17 |
| 5624582 |
Optimization of dry etching through the control of helium backside pressure |
— |
1997-04-29 |
| 5610105 |
Densification in an intermetal dielectric film |
Landon B. Vines, Sigmund Koenigseder, Chang-Ou Lee, Felix Fujishiro |
1997-03-11 |
| 5503881 |
Method of processing a semiconductor wafer |
Michael P. Relue, Michael E. Costabile, William P. Marsh |
1996-04-02 |
| 5439524 |
Plasma processing apparatus |
Michael P. Relue, Michael E. Costabile, William P. Marsh |
1995-08-08 |
| 5434104 |
Method of using corrosion prohibiters in aluminum alloy films |
Landon B. Vines, Sigmund Koenigseder, Chang-Ou Lee, Felix Fujishiro |
1995-07-18 |
| 5433238 |
Pumping system for evacuating reactor chambers |
Stephen J. Cannizzaro, Jr., Miguel A. Delgado, Ramiro Solis |
1995-07-18 |
| 5433823 |
Selective dry-etching of bi-layer passivation films |
— |
1995-07-18 |
| 5342476 |
Reduction of polycide residues through helium backside pressure control during dry etching |
— |
1994-08-30 |
| 5336366 |
New dry etch technique |
Chang-Ou Lee |
1994-08-09 |
| 5329161 |
Molybdenum boride barrier layers between aluminum and silicon at contact points in semiconductor devices |
Landon B. Vines, Chang-Ou Lee, Sigmund Koenigseder, Felix Fujishiro |
1994-07-12 |
| 5286518 |
Integrated-circuit processing with progressive intermetal-dielectric deposition |
Felix Fujishiro, Chang-Ou Lee, Sigmund Koenigseder, Landon B. Vines |
1994-02-15 |
| 5242532 |
Dual mode plasma etching system and method of plasma endpoint detection |
— |
1993-09-07 |