Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5745990 | Titanium boride and titanium silicide contact barrier formation for integrated circuits | Landon B. Vines, Felix Fujishiro, Sigmund Koenigseder | 1998-05-05 |
| 5610105 | Densification in an intermetal dielectric film | Landon B. Vines, Sigmund Koenigseder, John L. Cain, Felix Fujishiro | 1997-03-11 |
| 5493132 | Integrated circuit contact barrier formation with ion implant | Hunter B. Brugge, Kuang-Yeh Chang, Felix Fujishiro, Walter D. Parmantie | 1996-02-20 |
| 5434104 | Method of using corrosion prohibiters in aluminum alloy films | John L. Cain, Landon B. Vines, Sigmund Koenigseder, Felix Fujishiro | 1995-07-18 |
| 5336366 | New dry etch technique | John L. Cain | 1994-08-09 |
| 5329161 | Molybdenum boride barrier layers between aluminum and silicon at contact points in semiconductor devices | Landon B. Vines, John L. Cain, Sigmund Koenigseder, Felix Fujishiro | 1994-07-12 |
| 5294571 | Rapid thermal oxidation of silicon in an ozone ambient | Felix Fujishiro, Landon B. Vines | 1994-03-15 |
| 5286518 | Integrated-circuit processing with progressive intermetal-dielectric deposition | John L. Cain, Felix Fujishiro, Sigmund Koenigseder, Landon B. Vines | 1994-02-15 |