Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7642634 | Chip package and stacked structure of chip packages | — | 2010-01-05 |
| 7608923 | Electronic device with flexible heat spreader | — | 2009-10-27 |
| 7547965 | Package and package module of the package | — | 2009-06-16 |
| 7485974 | Chip structure with bevel pad row | Yuan-Tsang Liaw, Hung-Wen Shih | 2009-02-03 |
| 7470864 | Multi-conducting through hole structure | Kwun-Yao Ho, Moriss Kung, Jimmy Hsu | 2008-12-30 |
| 7449788 | Chip structure with arrangement of side pads | Yuan-Tsang Liaw, Hsing-Chou Hsu | 2008-11-11 |
| 7382629 | Circuit substrate and method of manufacturing plated through slot thereon | — | 2008-06-03 |
| 7378601 | Signal transmission structure and circuit substrate thereof | Jimmy Hsu | 2008-05-27 |
| 7365418 | Multi-chip structure | — | 2008-04-29 |
| 7361982 | Bumpless chip package | — | 2008-04-22 |
| 7291916 | Signal transmission structure and circuit substrate thereof | Hsing-Chou Hsu | 2007-11-06 |
| 7253526 | Semiconductor packaging substrate and method of producing the same | Wen-Yuan Chang | 2007-08-07 |
| 7230332 | Chip package with embedded component | — | 2007-06-12 |
| 7224062 | Chip package with embedded panel-shaped component | — | 2007-05-29 |
| 7193324 | Circuit structure of package substrate | — | 2007-03-20 |
| 7145234 | Circuit carrier and package structure thereof | Kenny Chang | 2006-12-05 |
| 7129146 | Flip chip package and process of forming the same | — | 2006-10-31 |
| 7129568 | Chip package and electrical connection structure between chip and substrate | Sheng-Yuan Lee | 2006-10-31 |
| 7053638 | Surrounding structure for a probe card | Jimmy Hsu | 2006-05-30 |
| 7038309 | Chip package structure with glass substrate | Kenny Chang | 2006-05-02 |
| 6946738 | Semiconductor packaging substrate and method of producing the same | Wen-Yuan Chang | 2005-09-20 |
| 6882057 | Quad flat no-lead chip carrier | — | 2005-04-19 |
| 6861740 | Flip-chip die and flip-chip package substrate | — | 2005-03-01 |
| 6809262 | Flip chip package carrier | — | 2004-10-26 |
| 6777804 | Flip-chip package substrate | — | 2004-08-17 |