Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774498 | Flip-chip package substrate | Jimmy Hsu | 2004-08-10 |
| 6740965 | Flip-chip package substrate | Jimmy Hsu | 2004-05-25 |
| 6710459 | Flip-chip die for joining with a flip-chip substrate | — | 2004-03-23 |
| 6643136 | Multi-chip package with embedded cooling element | — | 2003-11-04 |
| 6596560 | Method of making wafer level packaging and chip structure | — | 2003-07-22 |
| 6395584 | Method for improving the liquid dispensing of IC packages | Chin-Hsing Chung, Wen-Fu Hsu | 2002-05-28 |