YL

Yuan-Tsang Liaw

VT Via Technologies: 2 patents #343 of 1,108Top 35%
Overall (All Time): #2,131,573 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7485974 Chip structure with bevel pad row Chi-Hsing Hsu, Hung-Wen Shih 2009-02-03
7449788 Chip structure with arrangement of side pads Chi-Hsing Hsu, Hsing-Chou Hsu 2008-11-11