Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian +7 more | 2011-05-03 |
| 7807508 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, Andrey Grinman, Charles Rosenstein, Felix Hazanovich, David Ovrutsky +2 more | 2010-10-05 |