Issued Patents All Time
Showing 51–75 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872810 | Fin field effect transistor device structure and method for forming the same | Lin-Yu Huang, Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2020-12-22 |
| 10867906 | Conductive structures in semiconductor devices | Tai-I Yang, Yu-Chieh Liao, Tien-I Bao | 2020-12-15 |
| 10867863 | Semiconductor device structure and method for forming the same | Lin-Yu Huang, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin +1 more | 2020-12-15 |
| 10868000 | Semiconductor device structure with epitaxial structure and method for forming the same | Li-Zhen Yu, Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2020-12-15 |
| 10847460 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +6 more | 2020-11-24 |
| 10833152 | Semiconductor device and manufacturing method thereof | Jung-Hung Chang | 2020-11-10 |
| 10818597 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Cheng-Chi Chuang | 2020-10-27 |
| 10818596 | Method for forming semiconductor device structure with graphene layer | Tai-I Yang, Tien-I Bao, Wei-Chen Chu | 2020-10-27 |
| 10755964 | Source/drain isolation structure and methods thereof | Lin-Yu Huang, Sheng-Tsung Wang, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2020-08-25 |
| 10700005 | Interconnect structure with air gaps | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2020-06-30 |
| 10680078 | Semiconductor arrangement and formation thereof | Tai-I Yang, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2020-06-09 |
| 10490500 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao +1 more | 2019-11-26 |
| 10468349 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +6 more | 2019-11-05 |
| 10290580 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Cheng-Chi Chuang | 2019-05-14 |
| 10276498 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2019-04-30 |
| 10177242 | Semiconductor arrangement and formation thereof | Tai-I Yang, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2019-01-08 |
| 10109519 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Yung-Chih Wang, Cheng-Chi Chuang | 2018-10-23 |
| 10109582 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +6 more | 2018-10-23 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu, Tien-I Bao | 2018-10-16 |
| 10074607 | Semiconductor device structure with graphene layer | Tai-I Yang, Tien-I Bao, Wei-Chen Chu | 2018-09-11 |
| 10032713 | Semiconductor device structure and method for forming the same | Yung-Chih Wang, Carlos H. Diaz | 2018-07-24 |
| 10002826 | Semiconductor device structure with conductive pillar and conductive line and method for forming the same | Tai-I Yang, Yu-Chieh Liao, Tien-I Bao | 2018-06-19 |
| 9875967 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2018-01-23 |
| 9865539 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu, Tien-I Bao | 2018-01-09 |
| 9837354 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Cheng-Chi Chuang | 2017-12-05 |