MC

Matthew T. Currie

TSMC: 52 patents #623 of 12,232Top 6%
AS Amberwave Systems: 46 patents #1 of 20Top 5%
📍 Brookline, MA: #9 of 3,196 inventorsTop 1%
🗺 Massachusetts: #266 of 88,656 inventorsTop 1%
Overall (All Time): #15,188 of 4,157,543Top 1%
98
Patents All Time

Issued Patents All Time

Showing 51–75 of 98 patents

Patent #TitleCo-InventorsDate
7709828 RF circuits including transistors having strained material layers Glyn Braithwaite, Richard Hammond 2010-05-04
7674335 Method of producing high quality relaxed silicon germanium layers Eugene A. Fitzgerald, Richard Westhoff, Christopher Vineis, Thomas A. Langdo 2010-03-09
7638842 Lattice-mismatched semiconductor structures on insulators Anthony J. Lochtefeld, Zhiyuan Cheng, Thomas A. Langdo 2009-12-29
7626246 Solutions for integrated circuit integration of alternative active area materials Anthony J. Lochtefeld, Zhi-Yuan Cheng, James Fiorenza 2009-12-01
7588994 Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain Thomas A. Langdo, Richard Hammond, Anthony J. Lochtefeld, Eugene A. Fitzgerald 2009-09-15
7566606 Methods of fabricating semiconductor devices having strained dual channel layers Anthony J. Lochtefeld, Christopher Leitz, Eugene A. Fitzgerald 2009-07-28
7541208 Methods for preserving strained semiconductor substrate layers during CMOS processing Anthony J. Lochtefeld 2009-06-02
7504704 Shallow trench isolation process Anthony J. Lochtefeld 2009-03-17
7494881 Methods for selective placement of dislocation arrays Anthony J. Lochtefeld, Christopher Leitz, Mayank Bulsara 2009-02-24
7432139 Methods for forming dielectrics and metal electrodes 2008-10-07
7420201 Strained-semiconductor-on-insulator device structures with elevated source/drain regions Thomas A. Langdo, Richard Hammond, Anthony J. Lochtefeld, Eugene A. Fitzgerald 2008-09-02
7416909 Methods for preserving strained semiconductor substrate layers during CMOS processing Anthony J. Lochtefeld 2008-08-26
7414259 Strained germanium-on-insulator device structures Thomas A. Langdo, Richard Hammond, Anthony J. Lochtefeld, Eugene A. Fitzgerald 2008-08-19
7410861 Methods of forming dynamic random access memory trench capacitors Mayank Bulsara, Anthony J. Lochtefeld 2008-08-12
7408214 Dynamic random access memory trench capacitors Mayank Bulsara, Anthony J. Lochtefeld 2008-08-05
7393733 Methods of forming hybrid fin field-effect transistor structures 2008-07-01
7375385 Semiconductor heterostructures having reduced dislocation pile-ups Richard Westhoff, Vicky Yang, Christopher Vineis, Christopher Leitz 2008-05-20
7368308 Methods of fabricating semiconductor heterostructures Christopher Vineis, Vicky Yang, Richard Westhoff, Christopher Leitz 2008-05-06
7335545 Control of strain in device layers by prevention of relaxation 2008-02-26
7332417 Semiconductor structures with structural homogeneity Richard Westhoff, Christopher Vineis, Vicky T. Yang, Christopher Leitz 2008-02-19
7326599 Gate material for semiconductor device fabrication Anthony J. Lochtefeld 2008-02-05
7307273 Control of strain in device layers by selective relaxation 2007-12-11
7297612 Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes Thomas A. Langdo, Richard Hammond, Anthony J. Lochtefeld, Eugene A. Fitzgerald 2007-11-20
7259108 Methods for fabricating strained layers on semiconductor substrates Eugene A. Fitzgerald 2007-08-21
7259388 Strained-semiconductor-on-insulator device structures Thomas A. Langdo, Richard Hammond, Anthony J. Lochtefeld, Eugene A. Fitzgerald 2007-08-21