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Lin Yu-Ting

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,369,307 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7446398 Bump pattern design for flip chip semiconductor package Pao-Kang Niu, Pei-Haw Tsao, Hao-Yi Tsai, Yung Kuan Hsiao, Chung Yu Wang +1 more 2008-11-04