Issued Patents All Time
Showing 101–107 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455211 | Integrated fan-out structure with openings in buffer layer | Wu Sen Chiu, Po-Hao Tsai, Jing-Cheng Lin | 2016-09-27 |
| 9425121 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Jui-Pin Hung, Jing-Cheng Lin | 2016-08-23 |
| 9378982 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jing-Cheng Lin, Jui-Pin Hung | 2016-06-28 |
| 9159678 | Semiconductor device and manufacturing method thereof | Po-Hao Tsai, Jui-Pin Hung | 2015-10-13 |
| 9142432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Jui-Pin Hung, Jing-Cheng Lin | 2015-09-22 |
| 8608868 | Method for improving surface mechanical properties of non-austenitic stainless steels | Kuen-Shyang Hwang, Yung-Chung Lu, Yang-Liang FAN, Po-Han Chen | 2013-12-17 |
| 8540825 | Low-temperature stainless steel carburization method | Kuen-Shyang Hwang, Yung-Chung Lu | 2013-09-24 |