KT

Kuo-Chyuan Tzeng

TSMC: 43 patents #784 of 12,232Top 7%
📍 Cukeng, TW: #4 of 12 inventorsTop 35%
Overall (All Time): #69,297 of 4,157,543Top 2%
43
Patents All Time

Issued Patents All Time

Showing 26–43 of 43 patents

Patent #TitleCo-InventorsDate
7271083 One-transistor random access memory technology compatible with metal gate process Kuo-Chi Tu, Chung-Yi Chen, C. Y. Shen, Chun-Yao Chen, Hsiang-Fan Lee 2007-09-18
7091543 Embedded dual-port DRAM process Ming-Hsiang Chiang, Wen-Chuan Chiang, Dennis Sinitsky 2006-08-15
6794254 Embedded dual-port DRAM process Ming-Hsiang Chiang, Wen-Chuan Chiang, Dennis Sinitsky 2004-09-21
6713406 Method for depositing dielectric materials onto semiconductor substrates by HDP (high density plasma) CVD (chemical vapor deposition) processes without damage to FET active devices Chu-Yun Fu 2004-03-30
6670664 Single transistor random access memory (1T-RAM) cell with dual threshold voltages Dennis Sinitsky, Chen-Jong Wang, Wen-Chaun Chiang 2003-12-30
6661049 Microelectronic capacitor structure embedded within microelectronic isolation region Chen-Jong Wang, Chung-Wei Chang 2003-12-09
6661050 Memory cell structure with trench capacitor and method for fabrication thereof Chen-Jong Wang, Chung-Wei Chang 2003-12-09
6638813 Method of forming a composite spacer to eliminate polysilicon stringers between elements in a pseudo SRAM cell Chen-Jong Wang, Chung-Wei Chang, Wen-Chuan Chiang, Wen-Cheng Chen, Kuo-Ching Huang 2003-10-28
6620679 Method to integrate high performance 1T ram in a CMOS process using asymmetric structure Chen-Jong Wang, Dennis Sinitsky 2003-09-16
6613690 Approach for forming a buried stack capacitor structure featuring reduced polysilicon stringers Chung-Wei Chang, Chen-Jong Wang, Min-Hsiang Chiang, Chi-Hsing Lo 2003-09-02
6569732 Integrated process sequence allowing elimination of polysilicon residue and silicon damage during the fabrication of a buried stack capacitor structure in a SRAM cell Min-Hsiung Chiang, Chung-Wei Chang 2003-05-27
6436762 Method for improving bit line to capacitor electrical failures on DRAM circuits using a wet etch-back to improve the bit-line-to-capacitor overlay margins Tse-Liang Ying, Min-Hsiung Chiang, Hsiao-Hui Tseng, Chung-Wei Chang 2002-08-20
6383863 Approach to integrate salicide gate for embedded DRAM devices Min-Hsiung Chiang, Hsiao-Hui Tseng, Hsien-Yuan Chang, Chung-Wei Chang 2002-05-07
6376294 Method to define poly dog-bone for word line strapping contact at stitch area in embedded DRAM process Wen-Chuan Chiang, Wen-Cheng Chen, Chen-Jong Wang 2002-04-23
6306767 Self-aligned etching method for forming high areal density patterned microelectronic structures Tse-Liang Ying, Wen-Chuan Chiang, Ming-Hsiang Chiang 2001-10-23
6242757 Capacitor circuit structure for determining overlay error Wen-Jye Chung 2001-06-05
6207492 Common gate and salicide word line process for low cost embedded DRAM devices Tse-Liang Ying, Chen-Jong Wang, Kevin Chiang 2001-03-27
6143621 Capacitor circuit structure for determining overlay error Wen-Jye Chung 2000-11-07