Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12257726 | Robot and robot hand-eye calibrating method | Chun-Tse Lee | 2025-03-25 |
| 12255112 | Test key and semiconductor die including the same | Tse-Pan Yang, Wei-Yang Lee, Kuo-Pei Lu | 2025-03-18 |
| 12249390 | Memory systems with vertical integration | Chieh Lee, Yi-Ching Liu, Chia-En Huang, Yih Wang | 2025-03-11 |
| 12249590 | Die-group package having a deep trench device | — | 2025-03-11 |
| 12243787 | Method of forming testing module and method for using the same | Kong-Beng Thei, Jung-Hui Kao | 2025-03-04 |
| 12237244 | High density through silicon conductive structures | — | 2025-02-25 |
| 12237303 | Vertically mounted die groups | — | 2025-02-25 |
| 12230613 | Vertical semiconductor package including horizontally stacked dies and methods of forming the same | Chia-Ping Lai | 2025-02-18 |
| 12230607 | Semiconductor device including power management die in a stack and methods of forming the same | Chia-Ping Lai | 2025-02-18 |
| 12224268 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Chia-Ping Lai | 2025-02-11 |
| 12218049 | Semiconductor structure and method for forming the same | Chia-Ping Lai | 2025-02-04 |
| 12183695 | Method of manufacturing package structure | Chia-Ping Lai | 2024-12-31 |
| 12154808 | System and method for wafer manufacturing process management | Mei-Hsuan Lin, Rong Fan | 2024-11-26 |
| 12154869 | Semiconductor package with high density of through-silicon vias (TSV) | — | 2024-11-26 |
| 12125761 | Semiconductor package including package seal ring and methods for forming the same | — | 2024-10-22 |
| 12107078 | Semiconductor die including fuse structure and methods for forming the same | Chia-Ping Lai | 2024-10-01 |
| 12096588 | Server chassis | Han-Sheng Chen, Po-Hsiu Chen, Hsieh-Liang Tsai | 2024-09-17 |
| 12094925 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2024-09-17 |
| 12094868 | Shielded deep trench capacitor structure and methods of forming the same | Chia-Ping Lai, Chien-Chang Lee | 2024-09-17 |
| 12094844 | Semiconductor package including test pad and bonding pad structure for die connection and methods for forming the same | — | 2024-09-17 |
| 12087729 | Multi-chip package having stress relief structure | — | 2024-09-10 |
| 12087709 | Guard ring and manufacturing method thereof | — | 2024-09-10 |
| 12080656 | Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the same | — | 2024-09-03 |
| 12068262 | Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the same | Chia-Ping Lai | 2024-08-20 |
| 12040242 | Three-dimensional device structure including seal ring connection circuit | Chien-Chang Lee, Chia-Ping Lai | 2024-07-16 |