Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040242 | Three-dimensional device structure including seal ring connection circuit | Chien-Chang Lee, Chia-Ping Lai | 2024-07-16 |
| 12030102 | Hemming system and method that incorporates expected springback to form a continuous path | Yi-Ping Huang, Ya-Hui Tsai, Wei Li, Bor-Tung Jiang, Chia-Hung Wu | 2024-07-09 |
| 12033959 | Dummy pattern structure for reducing dishing | — | 2024-07-09 |
| 12027403 | Pick-and-place system with a stabilizer | — | 2024-07-02 |
| 12027475 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Chien-Chang Lee, Chia-Ping Lai | 2024-07-02 |
| 12021069 | Semiconductor die and photoelectric device integrated in same package | Chia-Ping Lai | 2024-06-25 |
| 12015010 | Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same | Chia-Ping Lai | 2024-06-18 |
| 12009349 | Vertical semiconductor package including horizontally stacked dies and methods of forming the same | Chia-Ping Lai | 2024-06-11 |
| 12009405 | Deep trench capacitor including a compact contact region and methods of forming the same | Chia-Ping Lai, Chien-Chang Lee | 2024-06-11 |
| 12001308 | Creating method of classification model about hard disk efficiency problem, analysis method of hard disk efficiency problem and classification model creating system about hard disk efficiency problem | Yi-Ju Liao, Po-Hsiu Chen, Hsieh-Liang Tsai | 2024-06-04 |
| 11984376 | Stacked semiconductor device including a cooling structure | — | 2024-05-14 |
| 11940662 | Semiconductor structure and method for forming the same | Chia-Ping Lai | 2024-03-26 |
| 11935798 | Stacked semiconductor device test circuits and methods of use | — | 2024-03-19 |
| 11929348 | Vertically mounted die groups | — | 2024-03-12 |
| 11923355 | Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the same | — | 2024-03-05 |
| 11923263 | Semiconductor device and method of forming | — | 2024-03-05 |
| 11916037 | Method for bonding semiconductor devices, method for forming semiconductor structure and system for performing the method | — | 2024-02-27 |
| 11908838 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2024-02-20 |
| 11869859 | Die stack and integrated device structure including improved bonding structure and methods of forming the same | — | 2024-01-09 |
| 11862609 | Semiconductor die including fuse structure and methods for forming the same | Chia-Ping Lai | 2024-01-02 |
| 11862610 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Chia-Ping Lai | 2024-01-02 |
| 11854969 | Semiconductor structure and method for forming thereof | Chia-Ping Lai | 2023-12-26 |
| 11855130 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2023-12-26 |
| 11854867 | Semiconductor structure and method for forming the same | — | 2023-12-26 |
| 11837586 | Package structure and method of forming thereof | Sheng-Chih WANG | 2023-12-05 |