Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532613 | Structure and method for cooling three-dimensional integrated circuits | Chi-Wen Chang, Jui-Feng Kuan, Yi-Kan Cheng | 2022-12-20 |
| 11456261 | Semiconductor package structures and methods of manufacturing the same | Hui-Chen Hsu | 2022-09-27 |
| 11170150 | Method for making a semiconductor device | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2021-11-09 |
| 11094608 | Heat dissipation structure including stacked chips surrounded by thermal interface material rings | Po-Hsiang Huang, Chin-Chou Liu, Chin-Her Chien, Fong-Yuan Chang | 2021-08-17 |
| 11088084 | Electromagnetic shielding metal-insulator-metal capacitor structure | Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang, Yi-Kan Cheng +1 more | 2021-08-10 |
| 11043473 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Chih-Lin Chen, Chin-Chou Liu, Fong-Yuan Chang, Po-Hsiang Huang | 2021-06-22 |
| 10971485 | Solenoid inductors within a multi-chip package | Ka Fai Chang | 2021-04-06 |
| 10943729 | Entangled inductor structures | Ka Fai Chang, Chin-Chou Liu, Fong-Yuan Chang, Yi-Kan Cheng | 2021-03-09 |
| 10910365 | Structure and method for cooling three-dimensional integrated circuits | Chi-Wen Chang, Jui-Feng Kuan, Yi-Kan Cheng | 2021-02-02 |
| 10763253 | Structure and method for cooling three-dimensional integrated circuits | Chi-Wen Chang, Jui-Feng Kuan, Yi-Kan Cheng | 2020-09-01 |
| 10665550 | Electromagnetic shielding metal-insulator-metal capacitor structure | Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang, Yi-Kan Cheng +1 more | 2020-05-26 |
| 10634972 | Configurable heating device and method of using the same | Jui-Feng Kuan | 2020-04-28 |
| 10638543 | Photonic heater | — | 2020-04-28 |
| 10540475 | System for manufacturing a semiconductor device | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2020-01-21 |
| 10535635 | Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor | Chih-Lin Chen, Chin-Chou Liu, Fong-Yuan Chang, Po-Hsiang Huang | 2020-01-14 |
| 10467375 | Methods and systems to estimate power network noise | Hao-Tien Kan | 2019-11-05 |
| 10431541 | Semiconductor device, layout pattern and method for manufacturing an integrated circuit | Jian-Hong Lin, Hsin Chang, Yung-Sheng Huang, Yung-Huei Lee | 2019-10-01 |
| 10268788 | Method and system for frequency-aware input/output signal integrity analysis | Hao-Tien Kan | 2019-04-23 |
| 10192833 | Interposer and semiconductor package with noise suppression features | Feng-Wei Kuo, Huan-Neng Chen, Yen-Jen Chen, Yu-Ling Lin, Chewn-Pu Jou | 2019-01-29 |
| 10163787 | Semiconductor structure | Feng-Wei Kuo, Jui-Feng Kuan, Yi-Kan Cheng | 2018-12-25 |
| 10162244 | Configurable heating device | Jui-Feng Kuan | 2018-12-25 |
| 10157252 | Method and apparatus of a three dimensional integrated circuit | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2018-12-18 |
| 10095827 | Method of manufacturing a semiconductor device | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2018-10-09 |
| 9934352 | Method and system for manufacturing a semiconductor device | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2018-04-03 |
| 9773089 | Integrated circuit design method and system with color-coded components | Chi-Wen Chang, Yu-Tseng Hsien, Ya Yun Liu | 2017-09-26 |