Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027513 | Layout design methodology for stacked devices | Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Chin-Her Chien | 2024-07-02 |
| 12009260 | Method and system of forming integrated circuit | Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng | 2024-06-11 |
| 11756951 | Layout design methodology for stacked devices | Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Chin-Her Chien | 2023-09-12 |
| 11694973 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2023-07-04 |
| 11569146 | Semiconductor package and method of forming the same | Yong Su Han, David Ho, Ying Ying Lim | 2023-01-31 |
| 11545298 | Method of forming entangled inductor structures | Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Yi-Kan Cheng | 2023-01-03 |
| 11222884 | Layout design methodology for stacked devices | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Po-Hsiang Huang | 2022-01-11 |
| 11088084 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2021-08-10 |
| 11018080 | Semiconductor package and method of forming the same | Roshan Weerasekera, Surya Bhattacharya, Vempati Srinivasa Rao | 2021-05-25 |
| 10971485 | Solenoid inductors within a multi-chip package | Hui Yu Lee | 2021-04-06 |
| 10943729 | Entangled inductor structures | Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Yi-Kan Cheng | 2021-03-09 |
| 10811316 | Method and system of forming integrated circuit | Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng | 2020-10-20 |
| 10720339 | Fan-out wafer-level packaging method and the package produced thereof | Masaya Kawano | 2020-07-21 |
| 10665550 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2020-05-26 |