Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720358 | Semiconductor device having a liner layer with a configured profile and method of fabricating thereof | Joanna Chaw Yane Yin | 2020-07-21 |
| 10681800 | Thermal module mounting structure | Chih-Cheng Chou | 2020-06-09 |
| 10553481 | Vias for cobalt-based interconnects and methods of fabrication thereof | Yu-Jen Chang, Min-Yann Hsieh, Kuo-Hua Pan | 2020-02-04 |
| 10516030 | Contact plugs and methods forming same | Kuo-Hua Pan, Je-Wei Hsu, Jyun-Ming Lin, Chen-Huang Peng, Min-Yann Hsieh +1 more | 2019-12-24 |
| 10510751 | FinFET isolation structure and method for fabricating the same | Wen-Che Tsai, Min-Yann Hsieh, Kuo-Hua Pan | 2019-12-17 |
| 10332786 | Method for manufacturing a semiconductor device | Wen-Che Tsai, Min-Yann Hsieh, Kuo-Hua Pan | 2019-06-25 |
| 10304942 | Sidewall spacers for self-aligned contacts | Jyun-Ming Lin, Kuo-Hua Pan, Min-Yann Hsieh, C. H. Wu | 2019-05-28 |
| 10297669 | Substrate resistor and method of making same | Shu-Hui Wang, Mu-Chi Chiang | 2019-05-21 |
| 10088440 | Heat dissipation estimating method | Wei-Yi Lin, Meng-Lung Chiang, Yu-Hsuan Lin | 2018-10-02 |
| 10074558 | FinFET structure with controlled air gaps | Wen-Che Tsai, Min-Yann Hsieh, Kuo-Hua Pan | 2018-09-11 |
| 10076066 | Heat dissipating control module and related server device and heat dissipating control method | — | 2018-09-11 |
| 9941125 | Method for integrated circuit patterning | Tsung-Lin Yang, Kuei-Shun Chen, Min-Yann Hsieh, Po-Hsueh Li, Shih-Chi Fu +2 more | 2018-04-10 |
| 9882023 | Sidewall spacers for self-aligned contacts | Jyun-Ming Lin, Kuo-Hua Pan, Min-Yann Hsieh, C. H. Wu | 2018-01-30 |
| 9536980 | Gate spacers and methods of forming same | Yuan-Sheng Huang, Chao-Cheng Chen, Chun-Hung Lee, Po-Hsueh Li | 2017-01-03 |
| 9496325 | Substrate resistor and method of making same | Shu-Hui Wang, Mu-Chi Chiang | 2016-11-15 |
| 9282679 | Electronic device with phase change material microcapsule layer | Huang-Cheng Ke | 2016-03-08 |
| 9255585 | Fan structure and casing structure | Ting-Chiang Huang, Te-Chuan Wang | 2016-02-09 |
| 9235242 | Heat dissipating module having enhanced heat dissipating efficiency | Wen-Hsiung Yang, Shih-Huai Cho | 2016-01-12 |
| 9230828 | Source and drain dislocation fabrication in FinFETs | Zhiqiang Wu, Wen-Hsing Hsieh, Ting-Yun Wu, Carlos H. Diaz, Tzer-Min Shen +1 more | 2016-01-05 |
| 9143164 | Scalable serializer | Karthik Chandrasekharan, Ramamurthy Gorti, Gregory Djaja, Douglas Smith | 2015-09-22 |
| 8932936 | Method of forming a FinFET device | Chia-Chu Liu, Kuei-Shun Chen, Chih-Hsiung Peng, Chi-Kang Chang, Chiang Mu-Chi +3 more | 2015-01-13 |
| 8897012 | Electronic device and heat dissipation module thereof | Feng-Ku Wang, Yi-Lun Cheng, Chih-Kai Yang, Wei-Hsin Wu, Ming-Hung Lin | 2014-11-25 |
| 8866235 | Source and drain dislocation fabrication in FinFETs | Zhiqiang Wu, Wen-Hsing Hsieh, Ting-Yun Wu, Carlos H. Diaz, Ya-Yun Cheng +1 more | 2014-10-21 |
| 8514108 | Single stage and scalable serializer | Karthik Chandrasekharan, Ramamurthy Gorti, Gregory Djaja, Douglas Smith | 2013-08-20 |