Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9282679 | Electronic device with phase change material microcapsule layer | Hua Feng Chen | 2016-03-08 |
| 7954541 | Heat dissipation module | Feng-Ku Wang, Chih-Kai Yang, Yu-Chih Cheng, Cheng-Shang Chou | 2011-06-07 |
| 7405937 | Heat sink module for dual heat sources | Feng-Ku Wang, Chih-Kai Yang | 2008-07-29 |