Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486054 | Method to achieve robust solder bump height | Yang-Tung Fan, Li-Hsin Tseng, Kuang-Peng Lin, Ta-Yang Lin | 2002-11-26 |
| 5393697 | Composite bump structure and methods of fabrication | Shyh-Ming Chang, Yu-Chi Lee, Li-Hui Yang, Jwo-Huei Jou | 1995-02-28 |