Issued Patents All Time
Showing 251–260 of 260 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6143664 | Method of planarizing a structure having an interpoly layer | Liang-Gi Yao, Yue Chen, Wei-Ray Lin, Yeur-Luen Tu | 2000-11-07 |
| 6140456 | Chemicals and processes for making fluorinated poly(para-xylylenes) | Hui Wang, Giovanni Antonio Foggiato | 2000-10-31 |
| 6114227 | Chamber for reducing contamination during chemical vapor deposition | David Leksell, Ming Xi Chan, Joseph P. Ellul, Jeanne Luce, David Thomas Ryan +3 more | 2000-09-05 |
| 6086679 | Deposition systems and processes for transport polymerization and chemical vapor deposition | Hui Wang, Giovanni Antonio Foggiato | 2000-07-11 |
| 6079353 | Chamber for reducing contamination during chemical vapor deposition | David Leksell, Ming Xi Chan, Joseph P. Ellul, Jeanne Luce, David Thomas Ryan +2 more | 2000-06-27 |
| 6051321 | Low dielectric constant materials and method | Hui Wang, Giovanni Antonio Foggiato | 2000-04-18 |
| 6020458 | Precursors for making low dielectric constant materials with improved thermal stability | Hui Wang, Giovanni Antonio Foggiato | 2000-02-01 |
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas Alan Bishop, Kimcuc T. Tran +5 more | 1996-04-16 |
| 5358604 | Method for producing conductive patterns | Charles W. C. Lin, Tom J. Hirsch, Kimcuc T. Tran | 1994-10-25 |
| 5192581 | Protective layer for preventing electroless deposition on a dielectric | Tom J. Hirsch, Charles W. C. Lin, Heinrich Muller | 1993-03-09 |