Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658226 | Backside gate contact | Huan-Chieh Su, Li-Zhen Yu, Lin-Yu Huang, Lo-Heng Chang, Cheng-Chi Chuang +1 more | 2023-05-23 |
| 11658119 | Backside signal interconnection | Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng +6 more | 2023-05-23 |
| 11631638 | Semiconductor structure having an anchor-shaped backside via | Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang | 2023-04-18 |
| 11621197 | Semiconductor device with gate cut feature and method for forming the same | Huan-Chieh Su, Li-Zhen Yu, Lo-Heng Chang, Cheng-Chi Chuang, Kuan-Lun Cheng +1 more | 2023-04-04 |
| 11616143 | Semiconductor devices with backside power rail and methods of fabrication thereof | Huan-Chieh Su, Pei-Yu Wang, Chih-Hao Wang | 2023-03-28 |
| 11549805 | Projecting apparatus and projecting calibration method | Kai-Shiang GAN, Po-Lung Chen, Chien-Chun Kuo | 2023-01-10 |
| 11532744 | Gate cut structure and method of forming the same | Pei-Yu Wang, Huan-Chieh Su, Yi-Hsun Chiu, Cheng-Chi Chuang, Ching-Wei Tsai +2 more | 2022-12-20 |
| 11532550 | Semiconductor device structure having a multi-layer conductive feature and method making the same | Chia-Hao Chang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2022-12-20 |
| 11495491 | Structure and formation method of semiconductor device with stacked conductive structures | Chia-Hao Chang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2022-11-08 |
| 11495630 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu +2 more | 2022-11-08 |
| 11482595 | Dual side contact structures in semiconductor devices | Shih-Chuan Chiu, Chia-Hao Chang, Cheng-Chi Chuang, Chih-Hao Wang, Huan-Chieh Su +2 more | 2022-10-25 |
| 11450751 | Integrated circuit structure with backside via rail | Huan-Chieh Su, Li-Zhen Yu, Cheng-Chi Chuang, Shang-Wen Chang, Yi-Hsun Chiu +3 more | 2022-09-20 |
| 11443987 | Semiconductor devices with backside air gap dielectric | Huan-Chieh Su, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2022-09-13 |
| 11437279 | Method for fabricating a semiconductor device | Li-Zhen Yu, Huan-Chieh Su, Lo-Heng Chang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-09-06 |
| 11430823 | Method for manufacturing semiconductor image sensor device having deep trench isolation | Yen-Ting Chiang, Hsiao-Hui Tseng, Sheng-Chan Li, Yu-Jen Wang, Wei Chuang Wu +3 more | 2022-08-30 |
| 11430789 | Semiconductor devices with backside contacts and isolation | Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang | 2022-08-30 |
| 11404460 | Vertical gate field effect transistor | Ching-Chun Wang, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-08-02 |
| 11387233 | Semiconductor device structure and methods of forming the same | Huan-Chieh Su, Pei-Yu Wang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-07-12 |
| 11342229 | Method for forming a semiconductor device structure having an electrical connection structure | Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin +1 more | 2022-05-24 |
| 11335592 | Contact resistance between via and conductive line | Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin | 2022-05-17 |
| 11233005 | Method for manufacturing an anchor-shaped backside via | Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang | 2022-01-25 |
| 11227889 | Extra doped region for back-side deep trench isolation | Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-01-18 |
| 11222892 | Backside power rail and methods of forming the same | Huan-Chieh Su, Li-Zhen Yu, Shih-Chuan Chiu, Cheng-Chi Chuang, Yu-Ming Lin +1 more | 2022-01-11 |
| 11211419 | Composite bsi structure and method of manufacturing the same | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze +3 more | 2021-12-28 |
| 11195930 | Semiconductor devices with backside power rail and methods of fabrication thereof | Pei-Yu Wang, Huan-Chieh Su, Chih-Hao Wang | 2021-12-07 |