Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11402747 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2022-08-02 |
| 11335656 | Semiconductor device and method of manufacturing | Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2022-05-17 |
| 11239205 | Integrating passive devices in package structures | Ming-Fa Chen | 2022-02-01 |
| 11107779 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2021-08-31 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2021-08-17 |
| 11088041 | Semiconductor packages with shortened talking path | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-08-10 |
| 11080455 | Layout design of integrated circuit with through-substrate via | Ming-Fa Chen, Sen-Bor Jan, Meng-Wei Chiang | 2021-08-03 |
| 11031354 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Hsien-Wei Chen, Chen-Hua Yu | 2021-06-08 |
| 10996558 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2021-05-04 |
| 10937743 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Hsien-Wei Chen, Chen-Hua Yu | 2021-03-02 |
| 10930580 | Semiconductor device and method of manufacture | Sen-Bor Jan, Hsien-Wei Chen, Ming-Fa Chen | 2021-02-23 |
| 10861808 | Bonding structure of dies with dangling bonds | Hsien-Wei Chen, Ming-Fa Chen | 2020-12-08 |
| 10784219 | Semiconductor device and method of manufacturing | Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2020-09-22 |
| 10741506 | Seal ring for hybrid-bond | Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen, Hsien-Wei Chen | 2020-08-11 |
| 10620530 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2020-04-14 |
| 10535636 | Integrating passive devices in package structures | Ming-Fa Chen | 2020-01-14 |
| 10515874 | Semiconductor device and method of manufacture | Sen-Bor Jan, Hsien-Wei Chen, Ming-Fa Chen | 2019-12-24 |
| 10510676 | System and method for aligned stitching | Chang-Ching Yu, Ming-Fa Chen | 2019-12-17 |
| 10312201 | Seal ring for hybrid-bond | Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen, Hsien-Wei Chen | 2019-06-04 |
| 10157867 | Interconnect structure and method | Ying-Ju Chen, Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2018-12-18 |